PCB & Substrate Design Review
Eternawave's PCB & Substrate Design Review service provides essential quality assurance for advanced board and substrate projects, helping you catch errors, enhance performance, and ensure manufacturability before fabrication.
What We Deliver
Comprehensive Schematic and Layout Audit
Meticulous examination of all nets, component placements, critical signal paths, and power domains to detect possible electrical errors, design rule violations, and manufacturability risks.
Stackup and Impedance Evaluation
Verification of layer arrangement, ground/signal/power relationships, via structures, and impedance targets for both PCB and IC substrates—crucial for signal, power, and thermal integrity in high-density designs.
DFM and DFA Guidance
Design-for-manufacturability (DFM) and design-for-assembly (DFA) review to minimize production problems, lower costs, and streamline the path to market.
Substrate-Specific Checks
For BGA, flip-chip, and specialty IC packaging, analysis of fine lines/spaces, via reliability, supplier capability, and interposer compatibility to meet advanced semiconductor requirements.
Supplier Compatibility and Process Review
Cross-check with selected fab and assembly partners to verify process limits, QA protocols, and consent for complex stackups or embedded components—avoiding costly re-spins.
Actionable Review Report
Clear, actionable recommendations for layout improvements, process adjustments, and risk mitigation—enabling confident sign-off and smooth transition to fabrication.
Why Review?
A thorough PCB & Substrate Design Review helps decrease board spins, cut development costs, and reduce time-to-market—while safeguarding your product’s performance and reliability. Partner with Eternawave to ensure every design is ready for the real world.
