IC Substrates & UHDI PCB Design

IC Substrates & UHDI PCB Design

At the forefront of electronics miniaturization and system integration, Eternawave specializes in IC substrate and Ultra-High Density Interconnect (UHDI) PCB design. These technologies are essential for advanced semiconductor packaging, chiplet-based systems, and compact devices requiring the highest interconnect density and performance.

Advanced IC Substrate Solutions

• Design of Multilayer IC Substrates: Enabling high-speed, high-reliability connections between microchips and PCBs, our IC substrate designs feature finely routed lines, microvia architectures, and high-performance materials for superior electrical performance and thermal stability.
• Material Expertise: We recommend and implement advanced materials such as BT resin, high-Tg polyimide, and premium ceramics for exceptional mechanical strength, low CTE, and support for demanding environments.
• Collaboration & Customization: Our process ensures tailored stack-up planning and routing for each application, from standard silicon interposers to 2.5D/3D designs, focused on manufacturability and scalability.

Ultra-High Density Interconnect (UHDI) PCB Design

• Extreme Line/Space Precision: UHDI PCBs with sub-30μm line/space, built with advanced processes like mSAP, laser direct structuring, and photolithography, providing unmatched trace accuracy and integration capability.
• Microvia Technology: Laser-drilled microvias (<0.1mm) and stacked vias-in-pad for ultra-dense, multi-layer routing, ideal for next-generation wearables, RF modules, and high-speed computing.
• Embedded Component Integration: Support for system-in-substrate, in-embedded passive/active devices, and enhanced performance with reduced footprint and improved signal integrity.

Why Choose Eternawave?