Optimizing thermal performance and mechanical reliability of your electronic systems
EternaWave's Thermal Mechanical Analysis service ensures your electronic systems maintain optimal performance and reliability under thermal and mechanical stresses throughout their lifecycle.
Our thermal design services ensure optimal thermal management and performance stability across high-power photonic and electronic components. Through advanced multiphysics simulations and thermal modeling, we analyze conduction, convection, and radiation effects at both component and system levels. We deliver customized cooling solutions, including heatsink and cold plate designs, for both air- and liquid-cooled applications, with careful selection of materials including Thermal Interface Materials (TIMs) to enhance the heat transfer and performance. These strategies ensure temperature uniformity and long-term reliability in demanding telecom and AI data center environments.
We provide complete opto-mechanical design support for 2.5D and 3D integrated opto-electronics packaging, ensuring precise optical alignment, mechanical stability, and efficient coupling between components. Our design process incorporates STOP (Structural–Thermal–Optical–Performance) analysis to accurately predict system behavior under real operating conditions. By integrating thermal and structural simulations with optical modeling, we optimize mechanical design and material selection to minimize misalignment, thermal stress, and deformation—reducing optical loss caused by structural distortion and CTE mismatch between components. This approach delivers a robust high-performance solution for next-generation opto-electronics architectures.
We perform comprehensive stress analysis to ensure the structural integrity of advanced photonic and electronic packages, covering both static loading conditions such as warpage, thermal stress, and structural deformation analysis and dynamic loading conditions such as shock, vibration, and drop events at both component and system levels, in accordance with telecom and data center qualification standards requirements. Using finite element analysis (FEA) method, and by integrating these analyses with optimized material selection and geometry design, we identify potential failure risks in advance and deliver a robust design capable of reliable long-term performance.
We provide custom test socket solutions for optical and electrical characterization of advanced opto-electronic devices. Our designs ensure precise mechanical alignment, thermal management, and high-frequency signal integrity for packaged components, incorporating elastomer or pogo-pin contact technologies. Each socket is engineered for seamless integration with automated test systems, enabling fast, reliable, and repeatable characterization to support product development and qualification
We provide comprehensive reliability testing to validate performance and ensure the long-term durability of advanced opto-electronic packages and systems. Our services cover all stages, from wafer-level characterization to final package and system design qualification, simulating real-world environmental and operational conditions such as thermal cycling, humidity, shock, vibration, high- and low-temperature stress tests, and accelerated life testing. By combining predictive modeling with experimental validations, we assess package robustness, identify potential failure modes, and verify that designs meet rigorous qualification standards requirements. This approach ensures scalable, high-performance solutions that maintain reliability throughout the product lifecycle.
Thermal and mechanical stresses are leading causes of electronic system failures. Our analysis helps:
Contact our experts to ensure your products withstand thermal and mechanical stresses.
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